Thin layer chromatography plates

ABSTRACT

In an embodiment, a method for manufacturing a thin layer chromatography (“TLC”) plate is disclosed. The method includes forming a layer of elongated nanostructures (e.g., carbon nanotubes), priming the elongated nanostructures with one or more adhesion priming layers, and at least partially coating the elongated nanostructures with a coating. The coating includes a stationary phase and/or precursor of a stationary phase for use in chromatography. The stationary phase may be functionalized with hydroxyl groups by exposure to a base or acid. The stationary phase may further be treated with a silane (e.g., an amino silane) to improve the performance of the TLC plate. Embodiments for TLC plates and related methods are also disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/186,996 filed on 21 Feb. 2014, which is a continuation of U.S.application Ser. No. 13/368,869 filed on 8 Feb. 2012 (now U.S. Pat. No.8,702,984 issued on 22 Apr. 2014), the disclosures of each of theforegoing application are incorporated herein, in their entirety, bythis reference.

BACKGROUND

Chromatography and solid-phase extraction (“SPE”) are commonly-usedseparation techniques employed in a variety of analytical chemistry andbiochemistry environments. Chromatography and SPE are often used forseparation, extraction, and analysis of various constituents, orfractions, of a sample of interest. Chromatography and SPE may also beused for the preparation, purification, concentration, and clean-up ofsamples.

Chromatography and SPE relate to any of a variety of techniques used toseparate complex mixtures based on differential affinities of componentsof a sample carried by a mobile phase with which the sample flows, and astationary phase through which the sample passes. Typically,chromatography and SPE involve the use of a stationary phase thatincludes an adsorbent packed into a cartridge, column, or disposed as athin layer on a plate. Thin-layer chromatography (“TLC”) employs astationary phase that is spread in a thin layer on a carrier orsubstrate plate. A commonly-used stationary phase includes asilica-gel-based sorbent material.

Mobile phases are often solvent-based liquids, although gaschromatography typically employs a gaseous mobile phase. Liquid mobilephases may vary significantly in their compositions depending on variouscharacteristics of the sample being analyzed and on the variouscomponents sought to be extracted and/or analyzed in the sample. Forexample, liquid mobile phases may vary significantly in pH and solventproperties. Additionally, liquid mobile phases may vary in theircompositions depending on the characteristics of the stationary phasethat is being employed. Often, several different mobile phases areemployed during a given chromatography or SPE procedure. For example,gradient elution may be performed in which the mobile phase compositionis varied with time.

A typical TLC plate is prepared by mixing an adsorbent (which acts asthe stationary phase) with a small amount of an inert binder and water.The mixture may be spread as a relatively viscous slurry onto a carriersheet. The resulting plate can then be dried and activated in an oven.The resulting stationary phase is bound in place to the carrier sheet orother substrate by the binder. The presence of the binder can lead tosecondary interactions with the mobile phase, as well as a decrease inseparation efficiency.

SUMMARY

Embodiments of the invention are directed to TLC plates, methods ofusing such TLC plates in chromatography, and related methods ofmanufacture in which a plurality of elongated stationary phasestructures are formed and affixed to a substrate without the use of aseparate binder. The elimination of the use of any binder may preventunwanted secondary interactions, as well as improve separationefficiency.

In an embodiment, a method for manufacturing a TLC plate is disclosed.The method includes forming a catalyst layer over a substrate. A layerof elongated nanostructures (e.g., carbon nanotubes) is then formed overthe catalyst layer. The elongated nanostructures so formed are thenprimed by at least partially coating the elongated nanostructures withone or more adhesion priming layers that promote subsequent depositionand adhesion of a coating that includes a stationary phase or precursorof a stationary phase for use in chromatography. The stationary phasecoating or precursor thereof is then deposited on the one or moreadhesion priming layers. The coating adheres to the one or more adhesionpriming layers to a greater degree than the coating would adhere to theelongated nanostructures without the one or more adhesion priminglayers. In some embodiments, after depositing the coating, the elongatednanostructures may be at least partially removed.

In an embodiment, a TLC plate is disclosed. The TLC plate includes asubstrate, one or more residual priming adhesion layers disposed overthe substrate that remain once elongate nanostructures have been atleast partially removed, and a plurality of stationary phase structuresthat extend longitudinally away from the substrate. At least a portionof the plurality of stationary phase structures exhibits an elongatedgeometry and is substantially free of carbon nanotubes (“CNTs”) used astemplates for forming the stationary phase structures thereon. In anembodiment, the plurality of stationary phase structures is arranged onthe substrate in a selected pattern. The stationary phase structure(e.g., a silica material) may further include a plurality of silanolgroups bonded thereto which provide a functionalized surface forenhanced separation performance. Silane groups (e.g., an amino silane oran octadecyl silane) may also be bonded to the stationary phasestructure surface for improved performance.

In an embodiment, a method of performing chromatography is disclosed.The method includes providing a TLC plate including a substrate, one ormore residual priming adhesion layers disposed over the substrate thatremain once elongate nanostructures (and any carbon adhesion priminglayer(s)) have been oxidized away, and a plurality of stationary phasestructures extending longitudinally away from the substrate. At least aportion of the plurality of stationary phase structures exhibits anelongated geometry. The method further includes applying a sample to beanalyzed to the plurality of stationary phase structures of the TLCplate, and drawing a mobile phase through the plurality of stationaryphase structures having the sample applied thereto. The differentcomponents of the sample may be separated as the mobile phase and thesample interact with the TLC plate.

Features from any of the disclosed embodiments may be used incombination with one another, without limitation. In addition, otherfeatures and advantages of the present disclosure will become apparentto those of ordinary skill in the art through consideration of thefollowing detailed description and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic top plan view of an embodiment of a TLC plateintermediate structure including a substrate and a catalyst layerdisposed over the substrate, with the catalyst layer exhibiting a zigzagpattern;

FIG. 2 is a schematic top plan view of another embodiment of a TLC plateintermediate structure similar to FIG. 1, but the catalyst layerexhibits an alternative zigzag pattern;

FIG. 3 is a schematic top plan view of another embodiment of a TLC plateintermediate structure similar to FIG. 1, but the catalyst layerexhibits a substantially parallel spacing pattern;

FIG. 4 is a schematic top plan view of another embodiment of a TLC plateintermediate structure similar to FIG. 3, but the catalyst layerexhibits another substantially parallel spacing pattern;

FIG. 5 is a schematic top plan view of another embodiment of a TLC plateintermediate structure similar to FIG. 1, but the catalyst layerexhibits a diamond-shaped pattern;

FIG. 6 is a schematic top plan view of another embodiment of a TLC plateintermediate structure similar to FIG. 5, but the catalyst layerexhibits another diamond-shaped pattern;

FIG. 7 is a schematic top plan view of another embodiment of a TLC plateintermediate structure similar to FIG. 1, but the catalyst layerexhibits a honeycomb-like pattern;

FIG. 8 is a schematic top plan view of another embodiment of a TLC plateintermediate structure similar to FIG. 7, but the catalyst layerexhibits another honeycomb-like pattern;

FIG. 9 is a schematic top plan view of another embodiment of a TLC plateintermediate structure similar to FIG. 7, but the catalyst layerexhibits another honeycomb-like pattern;

FIG. 10A is a cross-sectional view of the TLC plate intermediatestructure of FIG. 1;

FIG. 10B is a cross-sectional view of the TLC plate intermediatestructure of FIG. 10A with CNTs grown on the catalyst layer;

FIG. 10C is a cross-sectional view of the TLC plate intermediatestructure of FIG. 10B once the CNTs have been primed with two adhesionpriming layers;

FIG. 10CC is a close-up transverse cross-sectional view of one of theprimed CNTs of FIG. 10C.

FIG. 10D is a cross-sectional view of the TLC plate intermediatestructure of FIG. 10C once the primed CNTs have been at least partiallycoated by a stationary phase coating;

FIG. 10DD is a close-up transverse cross-sectional view of one of thecoated, primed, and coated CNTs of FIG. 10D.

FIG. 10E is a cross-sectional view of the TLC plate intermediatestructure of FIG. 10D once the CNTs have been burned off, leaving behindany non-carbon priming layer(s) and the stationary phase structures;

FIG. 10EE is a close-up transverse cross-sectional view similar to FIG.10DD, but once the CNTs have been burned off;

FIG. 11A is a schematic top plan view of a TLC plate manufactured from aTLC plate intermediate structure similar to that of FIG. 1;

FIG. 11B is a close-up top plan view of the TLC plate intermediatestructure of FIG. 11A showing several of the high aspect ratio depositedstationary phase structures disposed on the TLC plate substrate;

FIG. 12 shows a scanning electron microscopy (“SEM”) image of anexemplary non-linear zig-zag stationary phase formed according to thepresent inventive methods;

FIG. 13A shows an SEM image of a TLC stationary phase formed by directlyapplying a silica stationary phase over CNTs through pseudo atomic layerdeposition (“ALD”), without any priming layer between the CNTs and thesilica stationary phase;

FIG. 13B shows an SEM image of a TLC stationary phase formed by applyinga silica stationary phase over CNTs through pseudo atomic layerdeposition (“ALD”), where the CNTs were first primed with amorphouscarbon;

FIG. 13C shows an SEM image of a TLC stationary phase formed by applyinga silica stationary phase over CNTs through pseudo atomic layerdeposition (“ALD”), where the CNTs were first primed with alumina;

FIG. 13D shows an SEM image of a TLC stationary phase formed by applyinga silica stationary phase over CNTs through pseudo atomic layerdeposition (“ALD”), where the CNTs were first primed with a priminglayer of amorphous carbon followed by a priming layer of alumina;

FIG. 14A shows a transmission electron microscopy (“TEM”) image of CNTsas grown;

FIG. 14B shows a TEM image of CNTs after having been primed withamorphous carbon;

FIG. 15A shows an SEM image of a TLC plate prepared without priming ofthe CNTs, and in which a silicon precursor of a silica stationary phaseis oxidized to silica simultaneously with oxidative removal of the CNTs;

FIG. 15B shows an SEM image of a TLC plate prepared with priming of theCNTs, and in which a silica stationary phase is directly deposited,requiring no oxidation of a stationary phase precursor, followed byoxidative removal of the CNTs at a relatively low temperature;

FIG. 16 is a scanning transmission electron microscopy (“STEM”) image ofan assembly according to an embodiment of the invention including a CNTcore primed with an amorphous carbon adhesion priming layer, an aluminaadhesion priming layer, and coated with a silica stationary phase; and

FIG. 17 shows the separation results of two fluorescent dyes on a TLCplate according to an embodiment of the invention;

FIG. 18 shows the separation results of four fluorescent dyes on a TLCplate according to an embodiment of the invention;

FIG. 19 is a STEM image of an assembly intermediate according to anembodiment of the invention including a CNT core primed with anamorphous carbon adhesion priming layer, and an alumina adhesion priminglayer; and

FIGS. 20A-20B show the separation results of a CAMAG test mixture on aTLC plate, with the TLC plates of FIGS. 20A and 20B having differentgeometries; and

FIG. 21 shows the deposition profile for carbon in the employed tubefurnace.

DETAILED DESCRIPTION I. INTRODUCTION

Embodiments of the invention are directed to TLC plates and relatedmethods of manufacture and use. The disclosed TLC plates may include aplurality of elongated stationary phase structures affixed to asubstrate without the use of a separate binder to provide a highlyporous structure suitable for chromatography applications. Theelimination of the use of any binder may prevent unwanted secondaryinteractions, as well as may improve separation efficiency.

The elongated stationary phase structures may be prepared with the useof one or more adhesion priming layers for promoting deposition andadhesion of the subsequently applied stationary phase materials or theirprecursor. Use of one or more priming layers aids in reducing orpreventing any tendency of the elongated stationary phase structures todelaminate, buckle, or otherwise separate from the substrate to whichthey are attached. In other words, they exhibit greater mechanicalstability. Use of an adhesion priming layer also aids in deposition ofthe stationary phase, allowing the deposition to occur more quickly andwith greater stationary phase thickness for a given processing cycle.

II. METHODS FOR MANUFACTURING TLC PLATES AND RESULTING TLC PLATES

In various embodiments, a TLC plate may be manufactured by forming alayer of elongated nanostructures on a substrate, priming the formedelongated nanostructures with one or more adhesion priming layers forpromoting deposition and adhesion of a subsequent coating, and then atleast partially coating the elongated nanostructures with a coating thatcomprises a stationary phase and/or a precursor to the stationary phasefor use in chromatography. While the description hereinbelow uses CNTsas an example of a suitable elongated nanostructure, other elongatednanostructures may be used, such as semiconductor nanowires with orwithout a porous coating, metallic nanowires with or without a porouscoating, nanopillars formed by nanoimprint lithography, combinations ofthe foregoing, or any other suitable nanostructure.

The CNTs may generally be vertically aligned relative to one another,although some contact and/or at least partially intertwining of adjacentCNTs may occur, which may provide increased mechanical stability toindividual “hedge” portions of a given pattern, or to the overall CNTforest. The CNTs are primed with one or more adhesion priming layers,and may then be coated with a stationary phase that has a thickness lessthan the CNT hedge spacing (i.e., leaving a “flow channel”), whichresults in a porous medium through which separation by means ofchromatography may occur. The resulting pattern may thus include aseries of hedges separated by flow channels. The CNT forest is used as aframework on which the primer and then the stationary phase may becoated and/or formed, resulting in a finished structure that isgenerally free of any binder for binding the stationary phase to thesubstrate.

The substrate may include a base, a backing layer disposed on the base,and a catalyst layer disposed on the backing layer that is used tocatalyze growth of CNTs over the substrate. Generally, the catalystlayer may be deposited onto the backing layer by any suitable technique.For example, placement of the catalyst layer may be accomplished using aphotolithography process, such as masking the catalyst layer and etchingto remove regions of the catalyst layer exposed through the mask. Suchphotolithography processes may be used to produce a catalyst layerhaving a selected non-linear (e.g., zigzag) pattern. Other patterningprocesses such as shadow masking with a stencil during catalystdeposition or printing may also be used. In another embodiment, thecatalyst layer may be applied so as to coat substantially the entiresubstrate.

The catalyst layer may comprise any suitable material that catalyzesgrowth of CNTs under suitable growing conditions (e.g., heating andexposure to a process gas such as H₂ and a carbon containing gas such asC₂H₄). Various transition metals may be suitable for use as a catalystlayer. Suitable metals include, but are not limited to iron, nickel,copper, cobalt, alloys of the forgoing metals, and combinations thereof.

The backing layer of the substrate provides support for the structuresof the TLC plate. For example, the backing layer provides a support onwhich the catalyst layer may be deposited, and may also function as adiffusion barrier to help prevent a chemical reaction between thecatalyst layer and the base. Examples of backing layer materials mayinclude, but are not limited to, silica (e.g., fused silica), alumina, alow-expansion high-temperature borosilicate glass (e.g., Pyrex 7740and/or Schott Borofloat glass), steel (e.g., stainless steel), a siliconwafer, a nickel substrate, or any other high-temperature glass or othersuitable material. In embodiments where the backing layer comprises amaterial other than alumina, the backing layer may be prepared for CNTgrowth by application of a thin layer of alumina over the non-aluminabacking layer. The alumina layer may have a thickness between about 5 nmand about 100 nm, more specifically between about 10 nm and about 50 nm,and most specifically between about 20 nm and about 40 nm (e.g., about30 nm).

A catalyst layer (e.g., iron) may be applied over the backing layer. Thecatalyst layer may have a thickness between about 0.1 nm and about 15nm, more particularly between about 0.5 nm and about 10 nm, and evenmore particularly between about 0.5 nm and about 8 nm (e.g., about 2 toabout 7 nm). For example, the catalyst layer may have a thickness ofabout 0.5 nm, about 1 nm, about 2 nm, about 3 nm, about 4 nm, about 5nm, about 6 nm, about 7 nm, about 8 nm, about 9 nm, about 10 nm, about11 nm, about 12 nm, about 13 nm, about 14 nm, or about 15 nm. Althoughspecific catalyst layer thicknesses are disclosed above, the inventorshave further found that varying the thickness of the catalyst layeraffects some or each of the diameter, density, or height of CNTs grownunder otherwise identical conditions. As such, according to anembodiment, the catalyst layer thickness may be altered to change one ormore of diameter, density, or height of the grown CNTs.

The catalyst layer may be applied in a selected linear pattern, aselected non-linear pattern, or other selected pattern, or may beapplied over substantially an entire surface of the backing layer.Various embodiments of patterns for the catalyst layer are shown inFIGS. 1-9. For example, FIGS. 1 and 10A show a TLC plate intermediatestructure 100 including a substrate 101 having a backing layer 102disposed on a base 103 and a catalyst layer 104 formed on backing layer102 in a non-linear zigzag pattern, with the patterned catalystrepresented by the dark lines. In some embodiments, periodic breaks maybe formed in some or all of the zigzag portions of catalyst layer 104 toprovide a more uniform average mobile phase velocity to the TLC plate tobe ultimately formed. FIG. 2 illustrates another embodiment of a zigzagpattern for catalyst layer 104, with the patterned catalyst representedby the dark lines (e.g., a series of “hedges” separated from one anotherby adjacent flow channels). FIGS. 3 and 4 each show a TLC plateintermediate structure 100 including substrate 101 having backing layer102 disposed on base 103 and catalyst layer 104 formed on backing layer102 in substantially parallel patterns according to another embodiment,with the patterned catalyst represented by the dark lines. FIGS. 5 and 6each shows a TLC plate intermediate structure 100 including substrate101 having backing layer 102 disposed on base 103 and catalyst layer 104formed on backing layer 102 in various repeating diamond patternsaccording to various embodiments, with the diamonds representing thecatalyst. FIGS. 7-9 each shows a TLC plate intermediate structure 100including a substrate 101 having backing layer 102 disposed on base 103and catalyst layer 104 formed on backing layer 102 in differenthoneycomb-like patterns according to various embodiments. FIGS. 1 and 2and 5-9 each show a non-linear catalyst pattern, while the patterns ofFIGS. 3 and 4 show generally linear catalyst patterns.

The catalyst layer 104 may be patterned to exhibit any desired spacingbetween adjacent portions of the patterned catalyst layer 104. Forexample, an average bed spacing “S” is shown in FIG. 1. In anembodiment, an average bed spacing between adjacent portions ofpatterned catalyst layer 104 is between about 0.2 μm and about 50 μm,more particularly between about 0.5 μm and about 20 μm, and mostparticularly between about 1 μm and about 10 μm (e.g., about 10 μm). Oneof ordinary skill in the art will appreciate that catalyst layer 104 maybe formed so as to have any desired pattern and/or spacing “S.” Inanother embodiment, the catalyst layer 104 may be formed so as to coversubstantially the entire backing layer 102, lacking any particulardistinct pattern. In some embodiments, catalyst layer 104 is spacedinwardly from edges of backing layer 102 in order to substantiallyprevent growth of CNTs on the edges. In some embodiments, the spacing“S” may vary in one or two directions, such as from zigzag portion tozigzag portion.

With catalyst layer 104 formed on backing layer 102, TLC plateintermediate structure 100 may be placed onto a suitable support (e.g.,a quartz support) within a furnace and heated to a temperature within arange of about 600° C. to about 900° C., more particularly between about650° C. to about 850° C., and even more particularly to between about700° C. to about 800° C. (e.g., about 750° C.). Prior to CNT growth, thecatalyst layer 104 may be annealed in an annealing process in which H₂or another process gas is flowed over the catalyst layer 104 (e.g.,within a fused silica tube) while the temperature is increased fromambient temperature to the temperature at which CNT growth will occur.Flow of H₂ may be about 300 cm³/min or other suitable flow rate.

A process gas (e.g., H₂, ammonia, N₂, or combinations thereof) and acarbon-containing gas (e.g., acetylene, ethylene, ethanol, methane, orcombinations thereof) are introduced and flowed over the catalyst layer104. A noble gas (e.g., argon) may also be included with thecarbon-containing gas stream to control the rate of growth of CNTs onand over the catalyst layer 104. Flow of the process gas andcarbon-containing gas (e.g., ethylene) may be within a ratio of about0.5:1 to about 1, more particularly between about 0.55:1 and about0.85:1, and even more particularly between about 0.6:1 and about 0.8:1.

Once the desired height of CNT growth is achieved, flow of the processgas and carbon-containing gas are turned off, and the furnace chambermay be purged with flow of a noble gas (e.g., argon) as the furnace ispartially cooled, for example to a temperature between about 100° C. toabout 300° C., more particularly between about 150° C. to about 250° C.,and even more particularly to between about 175° C. to about 225° C.(e.g., about 200° C.).

In one embodiment, and in order to achieve a higher aspect ratio of basewidth to CNT height, a “start/stop” method may be employed. For example,the carbon-containing gas may be turned off during CNT growth, causingthe CNTs to grow in a myriad of directions. This type of growth may bedesired in some embodiments, as it may lead to more mechanically stableCNTs (e.g., such adjacent CNTs may be more likely to contact and/or atleast partially intertwine with one another).

FIG. 10B is a cross-sectional view of an embodiment of a structuresimilar to that of FIGS. 1 and 10A in which CNTs 106 have been grown onand over catalyst layer 104. CNTs 106 may be grown to extendlongitudinally away from the substrate 101. For example, the CNTs mayextend substantially perpendicular (i.e., vertical) to respectivesurfaces of catalyst layer 104 and substrate 101. Grown CNTs 106 may besingle walled or multi-walled, as desired. Grown CNTs 106 may have anaverage diameter between about 3 nm and about 20 nm, more particularlybetween about 5 nm and about 10 nm (e.g., about 8.5 nm) and an averagelength of about 1 μm to about 2000 μm, about 5 μm to about 1000 μm,about 10 μm to about 500 μm, about 20 μm to about 400 μm, about 20 μm toabout 200 μm, about 100 μm to about 300 μm, about 10 μm to about 100 μm,or about 20 μm to about 200 μm. The grown CNTs 106 may exhibit anaverage aspect ratio (i.e., ratio of average length to average diameter)of about 10,000 to about 2,000,000, such about 10,000 to about1,000,000, or about 100,000 to about 750,000.

The average length to which CNTs 106 are grown may be chosen based onthe particular chromatography application. For example, the averagelength of the CNTs 106 may be about 2 μm to about 100 μm for ultra-thinlayer chromatography (“UTLC”), the average length of the CNTs 106 may beabout 100 μm to about 300 μm for high-performance thin layerchromatography (“HPTLC”), and the average length of the CNTs 106 may beabout 500 μm to about 2000 μm for preparative liquid chromatography(“PLC”).

Additional details regarding growth of CNTs 106 may be found in U.S.patent application Ser. Nos. 12/239,281 and 12/239,339 entitled X-RAYRADIATION WINDOW WITH CARBON NANOTUBE FRAME. Both of the aboveapplications claim priority to U.S. Provisional Patent Application No.60/995,881. U.S. patent application Ser. Nos. 12/239,281 and 12/239,339and U.S. Provisional Patent Application No. 60/995,881 is eachincorporated herein, in its entirety, by this reference. Further detailsmay be found in U.S. patent application Ser. No. 13/035,645 filed Feb.25, 2011, also herein incorporated by reference in its entirety.

Although CNTs 106 are illustrated as being uniformly spaced, CNTs 106may be at least partially intertwined with each other to form a verticalwall of CNTs 106. Furthermore, adjacent “hedges” of CNTs 106 maycomprise a plurality of grouped CNTs, which may be at least partiallyintertwined with each other (e.g., more than one CNT may be grown sideby side with the illustrated CNT on the shown catalyst layer 104). Onlyone CNT is shown on each catalyst layer 104 for simplicity. Such hedgesof CNTs may be separated by a flow channel between another adjacenthedge. As previously discussed, the at least partial intertwining and/orcontact of CNTs 106 with each other helps reduce, limit, or prevent thevertical wall of CNTs 106 from bending out of plane. Furthermore, therigidity of the wall of CNTs 106 may be further enhanced to reduce,limit, or prevent out of plane bending thereof by patterning catalystlayer 104 in a selected non-linear pattern (e.g., the pattern shown inFIG. 1) and growing respective portions of CNTs 106 on the individualnon-linear portions of catalyst layer 104 to form respective walls ofCNTs 106.

The CNTs are used as a framework to be infiltrated with a material thatmay increase the mechanical stability of the overall structure andprovide a stationary phase for use in chromatography applications. Thatsaid, it has been found that application of one or more priming layersto the CNTs in preparation for infiltration also further increases themechanical stability of the overall structure. For example, applicationof the priming layer(s) contributes to prevention or minimization anytendency of the resulting stationary phase to delaminate, buckle, orotherwise separate from the substrate 101.

Referring to FIG. 10C, after growth, CNTs 106 may be coated with one ormore adhesion priming layers for promoting subsequent deposition of alater applied coating that includes a stationary phase or precursor of astationary phase for use in chromatography. The one or more adhesionpriming layers may partially or substantially completely coat CNTs 106and intervening regions over backing layer 102 of substrate 101 betweenadjacent CNTs 106 and/or groups of CNTs 106. FIG. 10CC shows applicationof two priming layers 114 and 116. Each priming layer 114, 116 may berelatively thin. For example, the thickness of any given priming layermay be from about 1 nm to about 20 nm, from about 2 nm to about 15 nm,or from about 2 nm to about 12 nm. The priming layer may thus besignificantly thinner than a subsequently applied stationary phase orprecursor thereof (which may typically be about 100 nm in thickness).One purpose of the priming layer is to promote mechanical stability,subsequent deposition, and adhesion of the subsequently depositedstationary phase or precursor thereof.

Materials used for priming may be the same or similar materials as thoseused for infiltration with the stationary phase or its precursor.Examples of such priming materials include, but are not limited to,elemental silicon, silicon dioxide, silicon nitride, elemental aluminum,aluminum oxide, elemental zirconium, zirconium oxide (e.g., zirconiumdioxide), elemental titanium, titanium oxide, amorphous carbon,graphitic carbon, and combinations of the foregoing. In one embodiment,the priming layers are selected from amorphous carbon, aluminum oxide,and combinations thereof. For example, in an embodiment, priming layer114 adjacent to CNTs 106 may comprise amorphous carbon, while priminglayer 116 adjacent to priming layer 114 may comprise alumina (i.e.,aluminum oxide).

Application of the one or more priming layers may be achieved atappropriate temperatures. For example, deposition of amorphous carboncan be carried out at a temperature at a somewhat higher range than thatdescribed above relative to CNT growth. For example, deposition ofamorphous carbon can be carried out from about 800° C. to about 1000°C., from about 850° C. to about 950° C., or about 900° C. while flowingethylene and argon over the CNTs. In one embodiment, the amorphouscarbon priming layer is formed to be not more than about 10 nm thick,from about 2 nm to about 8 nm thick, or from about 3 nm to about 5 nmthick. FIGS. 14A-14B illustrate TEM images of CNTs prior to priming (seeFIG. 14A) and after priming with a layer of amorphous carbon (see FIG.14B).

Deposition of alumina as a priming layer by ALD may be carried out atsignificantly lower temperatures, e.g., from about 150° C. to about 350°C., from about 200° C. to about 300° C., or about 250° C. while cyclingtrimethylaluminum and water in a serial, repeating (e.g., in an ABABfashion) for a desired number of cycles. Deposition of about 0.1 nm percycle is typical. In one embodiment, the alumina layer is formed to befrom about 5 nm to about 15 nm thick, or from about 6 nm to about 12 nmthick.

In one embodiment, at least one of the priming layers may be a materialthat is different from the subsequently applied stationary phase orprecursor thereof (e.g., not silicon or silicon dioxide where thestationary phase is such a material). In one embodiment, all priminglayers may be different from the subsequently applied stationary phaseor precursor thereof. Furthermore, where more than one priming layer isapplied, the priming layers may comprise different materials. Depositionof the one or more priming layers may be accomplished through atomiclayer deposition (“ALD”), ALD-like processes (also referred to herein aspseudo ALD) or another suitable process, or from a solution via solutiondeposition processing. It has surprisingly been found that applicationof one or more relatively thin priming layers (e.g., a few nanometers)may advantageously result in significantly less incidence ofdelamination of the subsequently applied stationary phase or precursorthereof from the substrate. It also has been found to promote betteradhesion and growth of the stationary phase during infiltration (i.e.,resulting in faster fabrication).

Once CNTs 106 have been primed, they may be infiltrated with astationary phase or stationary phase precursor. Referring to FIG. 10D,after growth, primed CNTs 106 may be infiltrated with one or moreinfiltrants (e.g. a precursor gas) so that a coating 108 deposits onpriming layer 116 adjacent the CNTs 106. Coating 108 comprises astationary phase and/or a precursor to the stationary phase. Examples ofmaterials for coating 108 include, but are not limited to, elementalsilicon (e.g., deposited from a precursor SiH₄ gas), silicon dioxide,silicon nitride, elemental aluminum, aluminum oxide, elementalzirconium, zirconium oxide (e.g., zirconium dioxide), elementaltitanium, titanium oxide, amorphous carbon, graphitic carbon, andcombinations of the foregoing. Because the choice of coating 108 maychange the selectivity of the resulting TLC plate, coating 108 used formanufacture of any given TLC plate may be selected depending on theintended use of the TLC plate.

In one embodiment, infiltration of CNTs 106 may be accomplished usingchemical vapor deposition (e.g., low pressure chemical vapor deposition(“LPCVD”)) or another suitable deposition process (e.g., ALD orpseudo-ALD). Silica may be directly deposited by cyclingtrimethylaluminum (“TMA”) and tris(tert-butoxy)silanol (((CH₃)₃O)₃SiOH)(“TTBS”) in a serial, repeating (e.g., in an ABAB fashion) fashion. Forexample, where depositing silica, the TLC plate intermediate structureshown in FIG. 10B may be placed into a furnace and heated to about 150°C. to about 350° C., more particularly between about 200° C. to about300° C., and even more particularly to between about 225° C. to about250° C. (e.g., about 235° C.). Under such conditions, the TMA/TTBSreactants flow over primed CNTs 106 to cause a coating 108 (see FIG.10D) of silica to form on primed CNTs 106. A thickness of about 13 nmper cycle can be achieved, for a final silica thickness of about 50 toabout 125 nm (e.g., about 100 nm) after a desired number of cycles(e.g., 8 cycles).

FIG. 13A shows an SEM micrograph of a CNT structure that was infiltratedwith 8 cycles of a silicon dioxide coating (about 104 nm thick). Nopriming of the CNTs was employed in FIG. 13A. FIG. 13B shows an SEMmicrograph of a CNT structure that was first primed with a 4 nm layer ofamorphous carbon and then infiltrated with 8 cycles of a silicon dioxidecoating (about 104 nm thick). FIG. 13C shows an SEM micrograph of a CNTstructure that was first primed with a 7 nm layer of alumina, and theninfiltrated with 8 cycles of a silicon dioxide coating (about 104 nmthick). FIG. 13D shows an SEM micrograph of a CNT structure that wasfirst primed with a 4 nm layer of amorphous carbon, followed by primingwith a 7 nm layer of alumina, and then infiltrated with 8 cycles of asilicon dioxide coating (about 104 nm thick).

When depositing silicon (which is later oxidized to silica), the TLCplate intermediate structure shown in FIG. 10B may be placed into afurnace and heated to about 500° C. to about 650° C., more particularlybetween about 540° C. to about 620° C., and even more particularly tobetween about 560° C. to about 600° C. (e.g., about 580° C.). Duringinfiltration, the infiltration pressure may be maintained at less thanabout 400 mTorr. For example, the infiltration pressure may bemaintained between about 50 mTorr and about 400 mTorr, more particularlybetween about 100 mTorr to about 300 mTorr, and even more particularlyto between about 150 mTorr to about 250 mTorr (e.g., about 200 mTorr).The amount of deposition of the coating material achieved may beaffected by process time. For example, process time for siliconinfiltration may be between about 0.5 hours and about 10 hours, moreparticularly between about 1 hours and about 5 hours, and mostparticularly between about 1 hours and about 4 hours (e.g., about 3hours).

Amorphous carbon infiltration of the CNTs 106 may be performed using acarbon source flowing through the fused silica tube at elevatedtemperatures. For example, ethylene may be flowed, for example, at arate of 170 cm³/min mixed with argon at a flow rate of 200 cm³/min andat a temperature of about 900° C. Due to the light absorptivecharacteristics of amorphous carbon, the detection of analytes afterseparation may require a post sample preparation. This process mayinclude marking the analytes with an oxidation stable marker andremoving the carbon in a high temperature oxygen environment (e.g., withan oxygen plasma). For example, the developing agent may comprisesilane, either in the gas phase or in solution, which would be appliedto the TLC plate. In an oxidative environment (e.g., an oven, a plasma,or flame), the carbon would be burned away leaving a pattern of SiO₂that would reveal where migration of analytes had occurred.

CNTs 106 may be infiltrated with elemental silicon by LPCVD and thenoxidized, if needed or desired, to form SiO₂. Other deposition processesfor SiO₂ include direct SiO₂ LPCVD, ALD, or by other CVD processes withSiH₄ and O₂ or SiH₂Cl₂ with N₂O, or by other methods for CNTinfiltration that will be apparent to one of skill in the art in lightof the present disclosure. The inventors have performed pseudo-ALD ofsilica directly onto the primed CNTs. The inventors have also performedLPCVD infiltration of CNTs with elemental silicon followed by dryoxidation. The silicon infiltration process employed SiH₄ as the sourcefor elemental silicon. The silicon infiltration was done by flowing SiH₄at a rate of about 20 cm³/min at a temperature of about 530° C. with apressure of about 160 mTorr for about 1-3 hours, depending on filmthickness (degree of infiltration) desired.

After the silicon deposition, the material is placed into a furnace inair and treated to between about 500° C. and about 1000° C. (e.g., about850° or 900° C.) for between about 1 and about 10 hours. This processconverted the elemental silicon to silicon dioxide, while also removingCNTs 106 by oxidizing them into CO and/or CO₂ thereby leaving elongatedstationary phase structures made from silicon dioxide without anysignificant amount of CNTs 106 filling. However, in additionalembodiments, the CNTs 106 may not be removed or they may only bepartially removed. Direct deposition of silica may be advantageous forone or more reasons, one of which is that the oxidizing step for removalof CNTs can be achieved at lower temperature (e.g., not more than 650°C., from about 500° C. to about 650° C., or about 600° C.) than whereoxidation of the stationary phase precursor is also required. Dependingon the extent of the oxidation process, the elongated stationary phasestructures may be substantially solid nanowires without a hollow centralportion where the CNTs 106 where present. This process produces a whiteand/or transparent SiO₂ material that may be used for chromatography.Silicon infiltration between and around the CNT wires may be nearlycomplete (e.g., at least about 90%).

ALD processes may be used to infiltrate CNTs 106 with a coating (e.g., aconformal coating) of a selected material having chromatographicabilities, or which may be subsequently processed to result in suchabilities. The above-described pseudo-ALD process enables deposition ofa relatively very thick layer of silica in a single cycle (e.g., about13 nm per cycle). Other similar processes may alternatively be used. Forexample, ALD may be used to infiltrate CNTs with SiO₂. One such processmay use SiCl₄ and water at a selected temperature. SiCl₄ is introducedinto the chamber containing CNTs 106 and is allowed to react therewithfor a predetermined time. After finishing the self-limitingchemisorptions/physisorption process, which may include removing most ofthe silicon precursor (SiCl₄), water is introduced into the chamberwhich reacts with the bound SiCl₄ to produce a conforming layer of SiO₂on CNTs 106. Most, or all, of the water in the chamber may then beremoved. This process is repeated until a predetermined film thicknessof SiO₂ is achieved. Such an ALD process may be significantly slower,providing only a ca. 0.1 nm thickness of silica deposition per cycle.Thus, the pseudo-ALD process may be faster, as it provides 130 timesgreater deposition per cycle.

Other ALD-like processes are also possible, another ALD-like process mayinclude introduction of SiCl₄, but excess SiCl₄ may or may not beentirely removed by pumping before water is introduced. In turn, excesswater may or may not be entirely removed before SiCl₄ is introduced. Bynot entirely removing excess reagent, as would be appropriate for a trueALD process, faster deposition of SiO₂ may be possible. This samestrategy of incomplete removal of material could be contemplated forother ALD chemistries that could be used to infiltrate CNTs 106. It isalso noted that perfect conformal coating of uniform thickness of CNTs106 may not always be desirable. An infiltration process may be designedto produce a rough non-uniform thickness coating so as to increase thesurface area of the support.

FIG. 10D is a cross-sectional view of the TLC plate intermediatestructure shown in FIG. 10C in which primed CNTs 106 have beeninfiltrated with infiltrant so that a coating material deposits ontopriming layer 116 on CNTs 106 to form coating 108 that at leastpartially coats and extends about a periphery of respective CNTs 106. Inthe case in which the infiltrant is a silicon precursor gas such assilane, coating 108 may be silicon. However, as discussed above, otherprecursor gases may be used so that coating 108 may be formed fromaluminum or zirconium, or oxides thereof (e.g., use of TMA/TTBS resultsin a coating of silicon dioxide). Depending on the infiltrant selected,coating 108 may at least partially or substantially coat the entirearray of primed CNTs 106 only, or it may also coat the interveningportions of backing layer 102 and catalyst layer 104 between the CNTs106, resulting in a TLC plate that is one coherent mass.

Coating 108 on respective primed CNTs 106 shown in FIG. 10D formsrespective high aspect ratio structures exhibiting an elongated annulargeometry (e.g., a substantially hollow cylinder). Primed CNTs 106 act astemplates around which the coating material deposits. In someembodiments, coating 108 may be porous or non-porous. The particularaspect ratio of the elongated structures made from coating 108 dependson the height of the template CNTs 106, the deposition time, the processtemperature (e.g., temperature of infiltrant and of CNTs 106), orcombinations of the foregoing process parameters. FIG. 10DD is aclose-up cross-sectional view of a single coated CNT 106 of FIG. 10D.The relative thicknesses of priming layers 114 and 116 is shown in closeup FIGS. 10CC and 10DD in order to more clearly show these features.

An average aspect ratio (i.e., ratio of average length to averagediameter) of the plurality of elongated structures defined by coating108 coating respective CNTs 106 may be about 10,000 to about 2,000,000,such about 10,000 to about 1,000,000, or about 100,000 to about 750,000.The average radial thickness of coating 108 coating the CNTs 106 may beabout 10 nm to about 250 nm, more particularly about 20 nm to about 150nm, and even more particularly about 50 nm to about 125 nm (e.g., about115 to 120 nm). The average length of the elongated structures definedby coating 108 may be substantially the same or similar as the templateCNTs 106.

FIG. 16 shows an STEM image of a CNT primed with a 4 nm layer of primingcarbon, a 10.5 nm layer of priming alumina after being coated withsilicon dioxide to form a silicon dioxide shell. The analysis resultsindicated the expected presence of carbon, aluminum, oxygen, andsilicon, with carbon at the center of the assembly, followed byaluminum, and then silicon. FIG. 19 is a STEM image of the assemblyintermediate prior to coating with the silica, so that the assemblyincludes a CNT core primed with an amorphous carbon adhesion priminglayer, and an alumina adhesion priming layer. No silica is yet present.

In some cases, random growth of CNTs 106 followed by infiltration andoptionally oxidation of coating 108 can pose a potential problem. Duringthe oxidation process of converting silicon to silicon dioxide, thematerial undergoes a volume expansion due to the addition of the oxygen.The volume expansion may cause the material to delaminate from thebacking, particularly during longer, more complete oxidation times andat relatively higher oxidation temperatures. Even if delamination doesnot appear to have occurred initially, the material may easily buckleand flake away as a result of a slight bump or touch because of theexpansion. One way to reduce, minimize, or eliminate such delamination,flaking, or buckling of the material from the backing is by patterning(e.g., zigzag or other non-linear) the CNT growth catalyst, which placesvoids into the overall structure allowing for volume expansion duringthe oxidation step. In addition, patterning of the stationary phasemedium on the micron-scale may improve separation efficiency.

Another way to aid in reducing, minimizing, or eliminating suchdistortion is to apply one or more priming adhesion layers to the CNTsprior to infiltration with the stationary phase or precursor thereof. Inaddition, by infiltrating with silicon dioxide rather than silicon, theoxidation step is not required to oxidize silicon to silicon dioxide,and can be achieved at a lower temperature than where the oxidation stepalso oxidizes the silicon to silicon dioxide. FIG. 15A illustrates anSEM image of a TLC plate prepared without priming of the CNTs and wherethe oxidation step oxidizes silicon to silicon dioxide. As readily seen,some distortion is visible where the flow channels between adjacenthedges substantially closes at a mid-section of each hedge (i.e.,furthest from where the 90° angle bend of the zig-zag occurs). FIG. 15Billustrates an SEM image of a TLC plate prepared as described herein,including application of a priming amorphous carbon layer and a primingalumina layer. In addition, the primed CNTs were infiltrated withsilicon dioxide, so that the oxidation step to remove the CNTs wasaccomplished at a relatively lower temperature (e.g., about 600° C. ascompared to 850° C. to 900° C.)

The selected zigzag pattern may include any of various angles of greaterthan 0° and less than 180° between the particular portions of thezigzag. For example, the zigzag patterns shown in FIGS. 1, 2, 11A, 11B,12, 15A, and 15B may include an angle of about 90° between adjacentportions of the zig and zag of the pattern.

As described above, an average bed spacing between adjacent portions ofpatterned catalyst layer 104 may be from about 0.25 μm to about 50 μm,more particularly from about 2 μm to about 20 μm, and most particularlyfrom about 5 μm to about 15 μm (e.g., about 10 μm). This spacing couldbe described as distance center to center from one “hedge” to another.The “hedge” width may be from about 0.25 μm to about 15 μm, from about 3μm to about 10 μm, or from about 4 μm to about 8 μm. The growth of CNTs106 followed by infiltration with infiltrant and/or growth of coating108 around CNTs 106 results in less spacing between adjacent elongatedstructures defined by coating 108 as they grow laterally outward andtowards one another. For example, an average spacing between adjacentelongated structures (i.e., “flow channel” width) defined by coating 108may be between about 0.5 μm and about 30 μm, more particularly betweenabout 2 μm and about 10 μm, and most particularly between about 4 μm andabout 8 μm. Such spacing results in a bulk structure having very highbulk porosity i.e., the spacing between adjacent structures act as poresthrough which the mobile phase and sample carried therewith advance as aresult of capillary action. In one embodiment, the flow channel widthmay be greater than the hedge width (e.g., 5 μm versus 4 μm). Whenpresent, porosity of any individual coating 108 (i.e., as opposed tobulk porosity resulting from spacing between adjacent structures) mayalso contribute to the overall porosity TLC plate.

In an embodiment, CNTs 106 may be partially or substantially completelyremoved once the coating 108 has been deposited onto CNTs 106. Forexample, the TLC plate intermediate structure shown in FIG. 10D may beplaced into a furnace and heated in the presence of an oxidizingatmosphere (e.g., an oxygen atmosphere) so as to remove (e.g., burn off)substantially all of CNTs 106, leaving only coating 108 disposed on thebacking layer 102 and catalyst layer 104 of TLC plate substrate 101. Insome embodiments, the stationary phase coating 108 does not requirefurther oxidation prior to use (e.g., it is deposited as silica ratherthan silicon).

In other embodiments, such an oxidation step may also serve to convertcoating 108 into the stationary phase by oxidizing the as-depositedcoating 108 if it is not already a chromatography capable stationaryphase. For example, if coating 108 is silicon, aluminum, or zirconium,it may be oxidized to silicon oxide, aluminum oxide, or zirconium oxide,respectively. An embodiment of a method for removal of the CNTs 106 mayinclude oxidizing coating 108 using an oxygen plasma. Other methods forat least partially removing CNTs 106 may include dissolution of CNTs106, or removal by any method.

Where the oxidation step also oxidizes the as deposited coating 108 intoan oxide stationary phase, the temperature may need to be higher thanwhere the oxidation step is not required to oxidize the depositedcoating. For example, where the coating is oxidized during the oxidationstep, the temperature may be from about 800° C. to about 900° C. (e.g.,about 850° C. to 900° C.). Where the oxidation step is not required tooxidize the coating 108 (e.g., because coating 108 was already depositedas a desired oxide such as silicon dioxide), the temperature may besubstantially lower (e.g., not more than about 750° C., not more thanabout 700° C., not more than about 650°, not more than about 600° C., orfrom about 500° C. to about 650° C., or about 600° C.). Methods thatdeposit coating 108 as an oxide rather than a precursor to an oxidestationary phase may be beneficial, as the lower processing temperaturemay further increase the mechanical stability of the resultingstationary phase of a TLC plate. In other words, because of the lowertemperature and the fact that no oxidizing of the coating 108 occursduring the oxidation step, less distortion of the zig-zag or otherpattern occurs (as shown by comparing FIGS. 15A-15B), providingincreased mechanical stability and durability.

FIG. 10E is a cross-sectional view of the structure shown in FIG. 10D inwhich the CNTs 106 have been removed. FIG. 10EE is a close upcross-sectional view of stationary phase structures 108′ once CNTs 106have been burned off. FIG. 10E clearly shows the overall high aspectratio configuration of the stationary phase structures 108′. Thedimensions of the plurality of elongated stationary phase structures108′ may be substantially the same or similar dimensions as theplurality of elongated structures defined by coating 108 prior tooxidation of CNTs 106. The oxidation process may occur for at leastabout 5 hours, more particularly at least about 10 hours, and mostparticularly for at least about 24 hours. Somewhat reduced processingtimes may be provided where oxidation of the coating 108 is not required(e.g., about 24 hours is typically sufficient).

As shown in FIGS. 10E and 10EE, in embodiments in which the coating 108is deposited by ALD or an ALD-like process (e.g., ALD deposition ofsilicon oxide), the resultant elongated stationary phase structures maybe hollow elongated cylinders, with the hollow being where a CNT 106 waslocated. Where the oxidation step also oxidizes coating 108, dependingon the extent of the oxidation process, the elongated stationary phasestructures 108′ may be substantially solid nanowires in which the spacepreviously occupied by the CNTs 106 is consumed or filled by the oxide.

Removal of CNTs 106 before use of the TLC plate may prevent CNTs 106from interfering (e.g., through a secondary interaction) with separationof an analyte mixture during use of the TLC plate. In addition, itresults in a white and/or transparent stationary phase; thereby makingevaluation of the chromatography results easier than if the stationaryphase is black or brown. In embodiments in which the coating 108comprises amorphous carbon, the CNTs 106 may not be removed, as both thecoating 108 and CNTs 106 comprise carbon, thereby substantiallyeliminating the possibility of a secondary interaction as a result ofthe CNTs 106 being present in the stationary phase formed duringinfiltration.

In a similar manner, it can be desirable, in some embodiments, that thecoating 108′ substantially fully coats and covers the adhesion priminglayer(s). Any amorphous carbon priming layer may simply be burned awaywith the CNTs, while an alumina priming layer remains after theoxidation step. Because exteriorly exposed alumina may interfere withthe separation results achieved by the TLC plate, the coating 108′ maysubstantially fully coat and cover any alumina adhesion priming layer,so that it is not exposed. For this reason and the fact that thepseudo-ALD deposition of silica may involve the use of an aluminumcompound (e.g., TMA), it may be beneficial to further hydrate thestationary phase surface with silanol groups and to apply an aminosilane or other silane to coat any exposed aluminum sites, as will bediscussed in further detail below.

In some embodiments, the stationary phase structures 108′ comprise amaterial that is white, off white, transparent, or generally light incolor so that the compounds of the mobile phase separated during use ofthe TLC plate are visible on the surface of the TLC plate after beingdeveloped. Silicon and/or silicon dioxide are examples of materials thatprovide such a color contrast. In some embodiments, a fluorescentmaterial (e.g., ZnS) may be incorporated in the TLC plate to produce afluorescently active TLC plate. This may be accomplished by depositing athin film on top of or a few monolayers beneath the chromatographicsupport. This may be done either in the liquid or gas phase. ALD, alongwith other CVD or liquid phase processes, can be used to place inorganicspecies into or onto the chromatographic support. For example, thefluorescent material may at least partially coat and/or may beincorporated in the stationary phase structures 108′, may at leastpartially coat intervening portions of backing layer 102 between thestationary phase structures 108′, or both. In an embodiment, thefluorescent material may be provided by depositing nanoparticles of afluorescent inorganic material from a solution or slurry.

After oxidation and removal of CNTs 106, in some embodiments, the TLCplate may be exposed to at least one acid (e.g., HF) or base (e.g.,NH₄OH) to hydrate the stationary phase structures 108′. For example, theTLC plate so formed may be placed in a furnace in the presence of HCl orother acid (or base) so that HCl (or other) vapors result in placementof hydroxyl or silanol groups onto the surface of stationary phasestructures 108′ to functionalize stationary phase structures 108′.Additional chemical functionality and selectivity may be added to thestationary phase structures 108′ by, for example, silanolization withalkyl moieties through any suitable gas phase chemistry. When thestationary phase structures 108′ comprise silica, the silica may also befunctionalized by bonding C₈ chains, C₁₈ chains, NH₂, or combinationsthereof to the silica.

For example, the TLC plate may be immersed in an acid solution for aselected time period. In an embodiment, the acid solution may comprise50:50 vol./vol. concentrated HCl and methanol and the TLC plate may beheated therein to reflux temperatures for several hours (e.g., 4-20hours). The methanol in the acid solution may aid in surface wetting.Other acids that may be used, such as nitric acid, HBr, HF, acetic acid,formic acid, trifluoroacetic acid, or combinations thereof. Exposure tothe HCl vapors or introduction of water vapor or acidified water vapor(including the above mentioned acids, or other suitable acids) into theoxidizing chamber while the material is being cooled or for apredetermined time at an elevated temperature may increase the number ofhydroxyl groups on the silica surface of the stationary phase structures108′. Bases such as NH₄OH may similarly be employed to hydrate thesurface.

In an embodiment, the stationary phase may be exposed to water vaporafter the oxidation step and during cooling from the oxidationtemperature to ambient temperature. Acidified water vapor may beemployed to hydroxylate the surface. For example, this may be done byplacing the TLC plate above a boiling HCl solution so that the vapors ofthe solution are allowed to interact with the stationary phase. Theboiling solution may include methanol to aid in surface wetting. Othercomponents that may be used include other strong acids (e.g., nitricacid, HBr, HF), organic acids (e.g., acetic acid, formic acid,trifluoroacetic acid) or other suitable chemical that can hydroxylatethe surface. In one embodiment, exposure may be about 5 minutes,although shorter or longer times may be employed.

Where a base is used, the stationary phase may be immersed in the baseetching solution at room temperature for a period of about 12 to about24 hours (e.g., about 18 hours). Exemplary bases that may be suitableinclude ammonium hydroxide, calcium hydroxide, sodium hydroxide,potassium hydroxides, other hydroxide salts, or combinations thereof.

The silanol containing surfaces may be silanized using a wide variety ofsilanes (e.g., mono-chlorosilanes, di-chlorosilanes, tri-chlorosilanes,or combinations thereof). Examples of suitable silanes include alkylsilanes (e.g., octadecyl trichlorosilane, octadecyldimethylchlorosilane,perfluoro alkyl silanes), amino silanes, phenyl silanes, cyano silanes,biphenyl silanes, or combinations thereof. Such silanes may bemonofunctional (e.g., including one Si—Cl group, one Si—OCH₃ group, oneSi—OCH₂CH₃ group, or one Si—OC(O)CH₃ group), or silanes bearing morethan one surface reactive functional group. Molecules such asoctadecyldiisopropylchlorosilane are contemplated, where the isopropylgroups impart added hydrolytic stability to the silica TLC plate.

In one embodiment, the stationary phase may be treated by deposition ofa an amino silane (e.g., 3-aminopropyltriethoxysilane (“APTES”)) tobetter cover reactive or acidic sites on the surface of the stationarymaterial. Other silanes such as those identified above may also beemployed. Such treatments may result in an improvement in thechromatographic performance of the material.

In an embodiment, the TLC plates may be produced with a concentrationzone. This involves having an area that has relatively low retentionwhere compounds may be spotted. This allows for the mobile phase toquickly pull the analyte through this area and then the analytes willslow down when they reach the normal sorbent bed. This can be done bymaking the pre-concentration area with a low density of the stationaryphase structures and/or selectively functionalizing this area with achemical species that allows for reduced retention of analytes.

In some embodiments, substrate 101 may be scribed or partially cutbefore or after growth of CNTs 106 and/or coating CNTs 106. By scribingor cutting substrate 101, smaller TLC plates may be fabricated bybreaking a larger TLC plate along a scribe/cut line of substrate 101.

FIG. 11A is a top plan view of an embodiment of a TLC plate 100′. FIG.11B is a close-up view of a portion of TLC plate 100′ includesstationary phase structures 108′ that are arranged between an end 110and an end 112 of TLC plate 100′. TLC plates prepared according to theinventive methods disclosed herein provide a stationary phase in whichthe stationary phase is affixed to the substrate of the TLC platewithout the use of any separate binding agent (e.g., calcium sulfate ora polymer). Such binding agents can interfere with the performance ofthe TLC plate as the result of secondary interactions resulting from thebinding agent. The reduction or the elimination of any binding agent mayresult in a more high efficiency TLC plate, while minimizing and/orpreventing such secondary interactions.

The spacing of the stationary phase structures 108′ is illustrated inFIGS. 11A and 11B as being generally uniform. However, in someembodiments, the density of the stationary phase structures 108′ may bedifferent (e.g., greater or less) in different locations of the TLCplate 100′. For example, the density of the stationary phase structures108′ may be different (e.g., greater or less) near end 110 than near end112. Additional structures 108′ may fill the smaller space betweenadjacent structure 108′ in a given hedge so that each hedge issubstantially continuous. Each hedge is separated from an adjacent hedgeby a flow channel therebetween (e.g., as shown in FIG. 12). As analternative to or in addition to the density of the stationary phasestructures 108′ varying with location, the composition of the stationaryphase structures 108′ may vary with location. As a non-limiting example,one portion of the stationary phase structures 108′ may comprisezirconium oxide and another portion of the stationary phase structures108′ may comprise silica.

Furthermore, TLC plates prepared according to the inventive methodsdisclosed herein provide a stationary phase having a particularly highporosity. The high porosity, as well as the absence of a binder mayresult in increased efficiency of the TLC plate during use in analyzinga sample within a mobile phase. In one embodiment, the TLC plates formedaccording to the disclosed methods are used to analyze a samplematerial. In one embodiment, the sample to be analyzed is applied to thestationary phase structures 108′ of TLC plate 100′ (e.g., near end 110).A mobile phase solvent or solvent mixture is then drawn along TLC plate100′ (e.g., upwardly) by capillary action (e.g., by placing TLC plate100′ in a container including the solvent or solvent mixture), or themobile phase solvent or solvent mixture by be forced through TLC plate100′. As the solvent or solvent mixture is drawn along the TLC plate100′ via capillary action toward opposite end 112, the sample isdissolved in the mobile phase and separation of components within thesample is achieved because different components of the sample ascend theTLC plate 100′ at different rates. The high aspect ratio stationaryphase structures 108′ as well as the bulk porosity as a result of thespacing between individual high aspect ratio stationary phase structures108′ results in excellent separation efficiency of components within thesample as the sample components are carried through the stationary phasestructures 108′ by the mobile phase (e.g., a solvent or solventmixture). The TLC plates 100′ may also be used in HPTLC in which one ormore of the method of use steps may be automated so as to increase theresolution achieved and to allow more accurate quantization.

III. WORKING EXAMPLES

The following working examples are for illustrative purposes only andare not meant to be limiting with regards to the scope of thespecification or the appended claims. Example 1 is representative of howthe CNT structures were grown for all examples carried out.

Example 1

The masks for photolithography were all based on a zig-zag geometry with90° angles. Silicon wafers (University Wafers, South Boston, Mass.), 4″diameter, were used as the backing material. A thin film of photoresist,AZ-3312-F (AZ Electronic Materials USA Corp, Somerville, N.J.), was spincoated onto the wafer. The resulting wafer was patterned viaphotolithography (Karl Suss Mask Aligner, Vermont, USA), followed bye-beam evaporation (Benton Vacuum E-beam Evaporator, Moorestown, N.J.)of a thin barrier layer of alumina (35 nm), and thermal evaporation(custom-built apparatus) of a few nanometers of iron (6 nm). The irondeposition was monitored using a quartz crystal device. The photoresistwas then lifted off with a resist stripper (Micropsoit 1165, MicroChem,Newton, Mass.), leaving a pattern of Al₂O₃/Fe at the surface.

The photolithographically patterned wafer was loaded into a fused silicatube (22 mm ID), preheated at 200° C. in a Lindberg/Blue M tube furnace(Thermo Electron Corporation, Marietta, Ohio), and then heated to 400°C. under flow of argon. The temperature was then raised from 400° C. to750° C. in an atmosphere of hydrogen (400 sccm) to reduce iron to itselemental form and simultaneously produce iron nanoparticles. CNTs weregrown for 2 minutes at 750° C. to a height of about 50 μm with ethylene(Grade 5.0, 99.999% from Air Gas) at 1000 sccm and hydrogen (Air Gas),at 400 sccm. The material was cooled under an atmosphere of argon to200° C.

Comparative Example 2

FIG. 13A shows an SEM image for a silica coating configuration of grownCNTs. As shown in FIG. 13A, the resulting thin SiO₂ films appliedwithout a priming layer lacked conformality and often showed a largenumber of pearl-like features. This lack of conformal growth may beexpected to negatively affect a TLC plate's mechanical stability. Totest mechanical stability, after removal of the CNTs via air oxidation,the TLC plate was submerged in water and immediate failure/delaminationwas observed. The pearl-like growth observed structure corresponding toFIG. 13A was thought to be the result of an insufficient number ofnucleation sites on the CNTs, which are quite chemically inert.

Examples 3-6

The use of one or more adhesion promoters (FIGS. 13B-13D), such as thecontemplated amorphous carbon and/or alumina priming layers discussed inmore detail below was believed to increase the number of nucleationsites on the CNTs, thereby allowing more conformal growth to take place.It was thought that only a very thin layer, perhaps only a fewnanometers, of one or more adhesion priming layers may be sufficient toincrease the number of nucleation sites available for subsequentinfiltration or coating (e.g., through ALD or similar process).Accordingly, a small amount of carbon was deposited onto CNTs usingethylene diluted in argon at 900° C. The resulting carbon layers showedgood conformality and even some measure crystallinity, as suggested bythe texture of the TEM images of FIGS. 14A and 14B.

To explore whether these few nanometers of carbon might improve ALD orpseudo-ALD on CNTs, and to show that these plates indeed exhibit thedesired stability and chromatographic properties, four types ofdepositions were performed on patterned CNT forests using differentcombinations of carbon (C), true ALD of Al₂O₃, and deposition ofpseudo-SiO₂: (i) Example 3—CNT-pseudo-SiO₂(8), (ii) Example 4—CNT-C(4nm)-pseudo-SiO₂(8), (iii) Example 5—CNT-Al₂O₃(7 nm)-pseudo-SiO₂(8), and(iv) Example 6—CNT-C(4 nm)-Al₂O₃(7 nm)-pseudo-SiO₂(8), where the numberin parentheses refers to the number of pseudo ALD cycles, one cyclereferring to the introduction of both precursors for the process.

Each series of depositions was then performed three times, from start tofinish, in separate fabrications. They were then oxidized to remove boththe CNT framework and the carbon adhesion priming layer. It was notnecessary to convert Si to SiO₂, so the nanotubes and carbon layer couldbe burned out at a relatively low temperature (about 600° C.). Finally,the plates were visually inspected for whiteness (the more white theplate the greater the degree of deposition, as it hid the darkersubstrate), and immersed in water. As expected, the CNT-pseudo-SiO₂(8)plates visually showed the least amount of SiO₂ deposition and all ofthem failed the water immersion test, showing immediatedelamination/removal of the layer. The CNT-C(4 nm)-pseudo-SiO₂(8) platesshowed more SiO₂ deposition, but about 50% of them (FIG. 13B) failed thewater immersion test. The CNT-Al₂O₃(7 nm)-pseudo-SiO₂(8) plates of FIG.13C performed about as well as the CNT-carbon(4 nm)-pseudo-SiO₂(8)plates, with one plate completely passing and about half of anotherplate passing the immersion test. The best performing substrates (FIG.13D) included both carbon and Al₂O₃ adhesion priming layers.

Structures of FIG. 13D showed the greatest deposition of inorganicmaterial (greatest whiteness) and 2.5 of 3 plates passed the immersiontest (only part of one plate failed). FIGS. 15A and 15B show SEMmicrographs of portions of TLC plates prepared without any priminglayers, and with oxidation of a silicon infiltrant to silica (FIG. 15A),showing some distortion of the features. FIG. 15B shows a portion of aTLC plate made with carbon and alumina adhesion priming layers and withdeposition of silica directly, so that no oxidation of the depositedstationary phase is required. The structure of FIG. 15B shows straight,undistorted features.

Example 7

More stable materials, which better withstood the water immersion test,were found to be possible by increasing the number of Al₂O₃ adhesionpriming layers from 70 cycles to 105 cycles (i.e., a thickness of 10.5nm rather than 7 nm). TEM/STEM analysis of the resulting CNT-C(4nm)-Al₂O₃(10.5 nm)-pseudo-SiO₂(8) materials showed the expectedsequential encapsulation of the CNTs and carbon with Al₂O₃ andpseudo-SiO₂ (see FIGS. 16 and 19).

TLC was then performed on the (CNT-C(4 nm)-Al₂O₃(10.5nm)-pseudo-SiO₂(8)) plates after hydrating the plates by immersion in apH 10 solution of NH₄OH for 18 hours, and rinsing with water toneutrality.

TLC was performed using the silica plates that were prepared including 4nm and 10.5 nm adhesion priming layers of amorphous carbon and aluminarespectively, followed by pseudo-ALD of silica. The silica plates werefurther hydrated before chromatography by immersion in a pH 10 NH₄OHsolution for 18 hours followed by rinsing with water to neutrality. Thiswas done to repopulate the silica surface with silanol (SiOH) groupsbecause the silica had been heated to a temperature of over 200° C. TLCof a CAMAG test dye mixture was then performed under normal phaseconditions with the recommended mobile phase (toluene). The run timesfor the plates were short: about 30 seconds development times for 30 mmdevelopment distances. In addition, all of the analytes in the testmixture generally showed substantial streaking except the fastest movinganalyte, which appeared as a tight band (in two instances with platecounts of about 77,000 N m⁻¹ and about 100,000 N m⁻¹) at a moderateretention factor (R_(f)) value of about 0.6. These results suggested thepresence of strongly adsorbing sites that interact to a greater extentwith the more polar (more strongly retained) analytes in the testmixture. The TLC plates of this test are shown in FIGS. 20A and 20B.

Example 8

Metal impurities, including aluminum, can create strongly adsorbingsites in silica that deleteriously affect chromatography. While intheory the plates as prepared should be entirely covered by silica, itwas thought that one possible source of strongly adsorbing sites couldbe aluminum from the pseudo-ALD deposition of SiO₂, i.e., alumina fromAl(CH₃)₃ is deposited as a catalyst at the start of each AB depositioncycle.

X-ray photoelectron spectroscopy (XPS) was performed on a CNT-amorphousC(4 nm)-Al₂O₃(7 nm)-pseudo-SiO₂ (8 cycles) plate to determine whetherany aluminum was present in the upper approximately 5 nm-10 nm of theSiO₂ film. A negative signal (no Al by XPS) would indicate that thealuminum was entirely covered with a thick layer of silica. A smallpositive signal would be ambiguous—the Al might be covered with amoderately thick film of SiO₂ or it might be near enough to the surfaceto create highly acidic/adsorptive sites. XPS showed about 2 atomicpercent Al on the TLC material. Interestingly, significantly less Al(0.2 atomic percent) was found on a planar pseudo-SiO₂ film, whichsuggested that the deposition of pseudo-SiO₂ on the curved nanotubes maynot be quite the same as on a planar substrate.

In addition to XPS, diffuse reflectance infrared Fourier transformspectroscopy (“DRIFTS”) was performed on the materials and compared witha commercially available silica material produced for HPLC. Highlyadsorptive silicas with highly acidic/isolated silanols that show poorchromatographic performance have peak maxima for silanols at or greaterthan 3740 cm⁻¹, while silicas that show better chromatographicperformance show a maximum below this value, which corresponds toassociated/more closely spaced/hydrogen bonded silanols. The DRIFTanalysis of our material gave a silanol peak position of 3740.5 cm⁻¹,suggesting the presence of at least some highly adsorptive sites, whilethe commercial silica standard gave a value of 3739.9 cm⁻¹.

Thus, chromatographic, XPS, and DRIFT analyses suggested that stronglyadsorbing sites might be present in the stationary phase/support andthat these strongly adsorptive sites may be due to aluminum. To furtherprobe this issue, a small amount (0.1%) of triethylamine (TEA) was addedto the mobile phase. TEA interacts strongly with isolatedsilanols/strongly adsorbing sites. TEA had two effects on TLCseparations. First, it changed the chromatographic characteristics ofthe mobile phase, by strengthening it, which resulted in higher R_(f)values for the analytes. In fact, the analytes largely ran together withR_(f) values of about 0.8. The addition of TEA eliminated streaking onthe plates. The results from these three experiments are consistent withthe presence of strongly adsorbing sites on the TLC plates.

Because of this, it may be advantageous to further treat the silicastationary phase with a material that will bind to or otherwise cover upany strongly adsorbing sites on the TLC plates. For this purpose, thesilica is treated with a silane, such as an amino silane (e.g.,3-aminopropyltriethoxysilane (APTES)). The thickness of the APTEScoating on the SiO₂ features of the TLC plates was monitored byspectroscopic ellipsometry via witness shards of planar silicon wafers(APTES thickness: 1.6±0.1 nm). The advancing and receding water contactangles on these planar surfaces were 46.3±1.7° and 8.4±1.0°. XPS alsoconfirmed APTES deposition, showing a small but noticeable nitrogensignal (N1s:Si2p ratio of 2:25) for the APTES-coated TLC plate.

FIGS. 17 and 18 show performance characteristics of TLC plates that alsoinclude such an amino silane coating. FIG. 17 shows separation of twofluorescent dyes, Eosin Y disodium and sulforhodamine B over a 30 mm rundistance using 1:100 LiCl:Methanol mobile phase. Analyte concentrationin the lower track was about 10% of the concentration of analytes in theupper track. The TLC plate shown in FIG. 17 included 3 μm wide hedgesand 5.66 μm flow channels (e.g., in a zig-zag pattern similar to thatseen in FIG. 12). Development occurred in 1:08 minutes. This sameseparation was performed on a commercially available amino-HPTLC plateunder the same conditions. Comparing the solvent front migration timesbetween the two TLC plates (microfabricated vs. HPTLC) the TLC plate ofFIG. 17 ran about 3 times faster (amino-HPTLC development time 3:26min).

The green spot on the TLC plate shown in FIG. 17 (labeled 118), which isprobably most representative of the separation, showed an R_(f) value of0.85 with 93,000 plates per meter (N m⁻¹). The orange spot (labeled120), which migrated further and with an R_(f) of 0.94, may have beenfocused by the solvent front so the corresponding value of N m⁻¹(158,000 N m⁻¹) may be inflated. This two component separation wasreproduced on three separate TLC plates. It was apparent that surfacefunctionalization with APTES rendered a material that was more suitablefor chromatography.

FIG. 18 shows a TLC plate similar to that of FIG. 17, but which was usedto separate four fluorescent dyes (Eosin Y disodium salt, sulforhodamineB, rhodamine 6G, and fluorescein sodium salt) using a 1:70:30LiCl:methanol:isopropanol mobile phase. Development occurred in 1:52minutes over a 30 mm distance (same distance as FIG. 17). Thisseparation showed improved efficiencies over the previous separations,which may be attributed to a reduction in the mobile phase migrationrate due to a more viscous mobile phase, and which may have allowed theseparation to occur at a more optimal mobile phase velocity. Theefficiencies obtained in this separation ranged from 125,000 to 225,000N m⁻¹ (more specifically, 125000, 225000, 175000, and 225000 N m⁻¹ atR_(f) values of 0.79, 0.86, 0.89, and 0.94, respectively). The separateddyes appeared as symmetrical bands, which would again be consistent withAPTES covering highly adsoptive sites on the pseudo-ALD deposited SiO₂.Comparing these results to a commercial available amino-phase HPTLCplate showed that our TLC plates were about 6 times more efficient andabout 4 times faster. Thus, microfabricated TLC plates allow for bothextremely efficient separations along with an increase in speed ofanalysis. The fluorescent images were captured under 254 nm light.

The use of one or more priming layers, the use of ALD type reactions tocoat the primed CNTs with silica, and further treatment with an aminosilane provides much higher efficiencies than previous work done by thepresent inventors. For example, the maximum number of theoretical platesper meter (N m⁻¹) previously obtained was about 75,000 N m⁻¹. Theprocess described above produced a chromatographic medium that gave amaximum of 225,000 N m⁻¹.

Example 9

Example 9 included both amorphous carbon and alumina adhesion priming ofthe CNTs, included coating silica directly onto the primed CNTs withoutthe need to oxidize a deposited stationary phase precursor, and whichalso included treatment with an amino silane to increase the separationefficiency of the resulting TLC plate. In these respects, Example 9 issimilar to Example 8.

The masks for photolithography were all based on a zig-zag geometry withabout 90° angles. In each case the hedges and flow channels were 100 μmlong between bends. One configuration included a 3 μm hedge width with a5.66 μm flow channel. Another configuration included a 4 μm hedge with a5 μm flow channel.

Silicon wafers (University Wafers, South Boston, Mass.), 4″ diameter,were used as the backing material. A thin film of photoresist, AZ-3312-F(AZ Electronic Materials USA Corp, Somerville, N.J.), was spin coatedonto the wafer. The resulting wafer was patterned via photolithography(Karl Suss Mask Aligner, Vermont, USA), followed by e-beam evaporation(Benton Vacuum E-beam Evaporator, Moorestown, N.J.) of a thin barrierlayer of alumina (35 nm), and thermal evaporation (custom-builtapparatus) of a few nanometers of iron (6 nm). The iron deposition wasmonitored using a quartz crystal device. The photoresist was then liftedoff with a resist stripper (Micropsoit 1165, MicroChem, Newton, Mass.),leaving a pattern of Al₂O₃/Fe at the surface.

The photolithographically patterned wafer was loaded into a fused silicatube (22 mm ID), preheated at 200° C. in a Lindberg/Blue M tube furnace(Thermo Electron Corporation, Marietta, Ohio), and then heated to 400°C. under flow of argon. The temperature was then raised from 400° C. to750° C. in an atmosphere of hydrogen (400 sccm) to reduce iron to itselemental form and simultaneously produce iron nanoparticles. CNTs weregrown for 2 minutes at 750° C. to a height of about 50 μm with ethylene(Grade 5.0, 99.999% from Air Gas) at 1000 sccm and hydrogen (Air Gas),at 400 sccm. The material was cooled under an atmosphere of argon to200° C.

To improve adhesion and better facilitate deposition of the laterapplied stationary phase, a thin layer (4 nm) of amorphous carbon wasdeposited onto the CNTs. The CNTs were placed in the same tube furnaceused for CNT growth and the temperature was raised to 900° C. under anargon atmosphere. Amorphous carbon was then deposited at 900° C. fromethylene (150 sccm) and argon (300 sccm) for 45 s (deposition rate wasabout 5 nm min⁻¹). Afterwards, the material was cooled to 200° C. underargon. The thickness of the amorphous carbon adhesion priming layer wasdetermined on planar (100) silicon substrates via spectroscopicellipsometry (M-2000D, J.A. Woollam Co., Inc., Lincoln, Nebr.). Inaddition to determining the deposition rate, the deposition profile ofthe furnace was measured to ensure that carbon was deposited in auniform manner over a uniform area (see FIG. 21).

ALD of a second adhesion priming layer comprising Al₂O₃ was performedusing a Cambridge Fiji F200 system (Cambridge NanoTech Inc., Cambridge,Mass.). Trimethylaluminum (97%, Sigma-Aldrich) and water were cycled ina serial, repeating (e.g., in an ABAB fashion) fashion. The depositionwas performed at 250° C. In one configuration, 70 AB cycles wereperformed to produce an Al₂O₃ film thickness of 7 nm. In anotherconfiguration, 105 AB cycles were performed to produce a film thicknessof 10.5 nm. Film thicknesses were monitored via ellipsometry (M-2000D,J.A. Woollam Co., Inc., Lincoln, Nebr.), with film growth of about 0.1nm cycle⁻¹.

Pseudo-ALD of SiO₂ was also performed with a Cambridge Fiji F200 systemusing trimethylaluminum (97%, Sigma-Aldrich) and TTBS (99.999%,Sigma-Aldrich), which were cycled in an ABAB type fashion. Thedeposition was performed at 235° C. at a rate of about 13 nm cycle⁻¹. 8cycles were performed to produce the SiO₂ film. Film thicknesses wereagain monitored via spectroscopic ellipsometry (M-2000D, J.A. WoollamCo., Inc., Lincoln, Nebr.).

To produce a white material for chromatography the CNTs were removed viaair oxidation. The silica coated CNTs were placed into a preheated (200°C.) bench top furnace (Thermolyne 6000 Furnace, Dubuque, Iowa) andheated to 600° C. at 1° C. min⁻¹. The material was held at 600° C. for17.33 hrs., for a total processing time of 24 hrs. The furnace was thencooled to 200° C.

Because the SiO₂ material was subjected to temperatures above 200° C.,it was further subjected to a silanol treatment to increase the numberof hydroxyl or silanol groups. Surface silanol repopulation wasperformed with a pH 10 NH₄OH etching solution at room temperature for 18hours. After 18 hours the material was removed from solution and rinsedwith deionized water to neutrality. The material was dried at 120° C.prior to chromatography or APTES deposition.

TLC plates were placed into a freshly prepared solution of 1% APTES(≧98%, Sigma-Aldrich) in water-saturated toluene (≧99.8%, Sigma-Aldrich)and heated to 70° C. The solution was held at this temperature for 10min after which the TLC plate was removed and rinsed three times withmethanol (≧99%, Sigma-Aldrich). The amino silane film thickness wasmeasured on a model planar silicon surface via spectroscopicellipsometry.

X-ray photoelectron spectroscopy (XPS) was performed with a SurfaceScience SSX-100 X-ray photoelectron spectrometer (serviced by ServicePhysics, Bend, Oreg.) with a monochromatic Al K_(α) source, ahemispherical analyzer, and a take-off angle of 35°. Survey scans aswell as narrow scans were recorded with an 800 μm×800 μm spot size. TheXP spectra were analyzed using the ESCA Data Analysis Application(Version: Analysis 25 V.01.02) software. Diffuse reflectance infraredFourier transform spectroscopy (DRIFTS) was performed using a ThermoScientific Nicolet 6700 FT-IR. Both the microfabricated material(scraped from microfabricated TLC plates) and commercially availablesilica (Sepax HP-Silica, 3 μm, 120 Å, Sepax Technologies, Inc.,Delaware) were scanned 128 times with a resolution of 0.964 cm⁻¹. Thespectra were analyzed using the instrument OMNIC 8.1.11 software.

Test dye mixture III solution in toluene containing indophenol, ariabelred, Sudan blue II, Sudan IV, and dimethylaminoazobenzene from CAMAG(Muttenz, Switzerland) was diluted in hexanes to produce a 1% v/vsolution. A 1 μL or 3 μL volume of this solution was applied as a 3 mmband at the bottom of the TLC plate using a Linomat 5 spotter (CAMAG,Muttenz, Switzerland). The band was applied 5 mm from the bottom of theplate. The plate was then placed in a 10×10 cm twin trough chamber(CAMAG, Muttenz, Switzerland) and pre-equilibrated with the vapors ofthe mobile phase, toluene (99.8%, Sigma-Aldrich) with or without 0.1%v/v triethylamine (99.5%, Sigma-Aldrich), for 10 min. After thepre-equilibration, 3 mL of the mobile phase was introduced at the bottomof the plate to commence chromatography. The TLC plate was developedover a 30 mm distance.

Eosin Y disodium salt (˜85%, Sigma-Aldrich) and sulforhodamine B (75%,Sigma-Aldrich) were dissolved together in methanol to concentrations ofabout 5×10⁻⁷ M. 0.5 μL of this solution was applied as a 3 mm band, 5 mmfrom the bottom of the TLC plate, using the Linomat 5 spotter (CAMAG,Muttenz, Switzerland). The spotted plate was placed in a twin troughchamber and allowed to pre-equilibrate with the vapors of the mobilephase, 1:100 LiCl:methanol (LiCl, >99%, EMD, Gibbstwon, N.J.), for 10minutes. After the pre-equilibration step, 3 mL of the mobile phase wasintroduced to commence chromatography. The TLC plate was developed overa 30 mm distance. The results are shown in FIG. 17.

Eosin Y disodium salt (˜85%, Sigma-Aldrich), sulforhodamine B (75%,Sigma-Aldrich), rhodamine 6G (˜95%, Sigma-Aldrich), and fluoresceinsodium salt (98%, Sigma-Aldrich) were dissolved in methanol to aconcentration of about 5×10⁻⁷ M. 0.5 μL of this solution was applied asa 3 mm band, 5 mm from the bottom of the TLC plate, using the Linomat 5spotter (CAMAG, Muttenz, Switzerland). The spotted plate was placed intothe twin trough chamber and allowed to pre-equilibrate with the vaporsof the mobile phase: 1:70:30 LiCl:methanol:isopropanol (isopropanol,≧99%, Sigma-Aldrich), for 10 minutes. After this pre-equilibration, 3 mLof the mobile phase was introduced to commence chromatography. The TLCplate was developed over a 30 mm distance. The results are shown in FIG.18.

Imaging of the separated dyes was performed using a digital camera(Canon PowerShot S95, Canon USA, Inc., Lke Success, N.Y.). The TLC platewas exposed to short wavelength UV light (254 nm) (Model UVG-11Mineralight Lamp, Ultra-Violet Products, Inc., San Gabriel, Calif.) forfluorescent visualization. All images were processed using ImageJ(ImageJ 1.42q, National Institutes of Health, USA).

Retention factors (R_(f)) were calculated with the following equation:

$R_{f} = \frac{Z_{s}}{Z_{f}}$

where Z_(s) is the analyte migration distance from the applicationorigin and Z_(f) is the distance the solvent front traveled also fromthe application origin. Chromatographic efficiencies were determined bythe number of theoretical plates (N) according to:

$N = {16\left( \frac{Z_{f}R_{f}}{W} \right)^{2}}$

where W is the width of the chromatographic band.

All SEM images were captured with an FEI Helios Nanolab 600 (Hillsboro,Oreg.). TEM images were captured using an FEI Tecnai F20 Analytical STEM(Hillsboro, Oreg.). The results achieved with Example 9 were as reportedabove relative to Example 8. For example, the TLC plates showed anefficiency that was about 6 times greater than commercially availableamino-phase HPTLC plates. In addition, the TLC plates were about 4 timesfaster.

The described embodiments may be used in different types of liquid orgas chromatography, such as high-performance liquid chromatography(“HPLC”), ultra-performance liquid chromatography (“UPLC”), microfluidicapplications, pressurized liquid chromatography, microfluidic ornanofluidic chromatography, circular or anti-circular TLC, and any othertype of chromatography application. Various columns or separations mediafor HPLC, UPLC, microfluidic applications containing the patterned orun-patterned infiltrated CNTs, a number of different assays (e.g.,fingerprinting of natural products or screening for radical scavengersand antioxidants) are within the scope of the present disclosure.

While various aspects and embodiments have been disclosed herein, otheraspects and embodiments are contemplated. The various aspects andembodiments disclosed herein are for purposes of illustration and arenot intended to be limiting. Additionally, the words “including,”“having,” and variants thereof (e.g., “includes” and “has”) as usedherein, including the claims, shall be open ended and have the samemeaning as the word “comprising” and variants thereof (e.g., “comprise”and “comprises”).

What is claimed is:
 1. A thin layer chromatography plate, comprising: asubstrate; one or more residual priming adhesion layers disposed overthe substrate; a plurality of stationary phase structures extendinglongitudinally away from the substrate, at least a portion of theplurality of stationary phase structures exhibiting an elongatedgeometry and being substantially free of carbon nanotubes; and aplurality of silanol groups bonded to the plurality of stationary phasestructures.
 2. The thin layer chromatography plate of claim 1, furthercomprising a plurality of hydroxyl groups bonded to the plurality ofstationary phase structures.
 3. The thin layer chromatography plate ofclaim 1 wherein each of the plurality of stationary phase structuresincludes at least one of a stationary phase or a precursor of thestationary phase.
 4. The thin layer chromatography plate of claim 3wherein the stationary phase or the precursor of the stationary phaseincludes at least one of elemental silicon, silicon dioxide, siliconnitride, elemental aluminum, aluminum oxide, elemental zirconium,zirconium oxide, elemental titanium, titanium oxide, amorphous carbon,graphitic carbon, or combinations thereof.
 5. The thin layerchromatography plate of claim 1 wherein the plurality of stationaryphase structures form a non-linear pattern over the substrate.
 6. Thethin layer chromatography plate of claim 1 wherein the one or moreresidual priming adhesion layers include a first adhesion priming layerand a second adhesion priming layer, wherein the first and secondadhesion priming layers include different materials.
 7. The thin layerchromatography plate of claim 1 wherein the one or more residual primingadhesion layers include a material that is different from a portion ofthe plurality of stationary phase structures.
 8. A thin layerchromatography plate, comprising: a substrate; one or more adhesionpriming layers disposed over the substrate, each of the one or moreadhesion priming layers exhibiting a thickness of about 1 nm to about 20nm; and a plurality of stationary phase structures formed on thesubstrate, at least some of the plurality of stationary phase structuresexhibiting an elongated geometry, the plurality of stationary phasestructures defining flow channels therebetween, each of the plurality ofstationary phase structures being formed on at least one of the one ormore adhesion priming layers.
 9. The thin layer chromatography plate ofclaim 8 wherein the plurality of stationary phase structures include atleast one of a stationary phase or a precursor of the stationary phase.10. The thin layer chromatography plate of claim 9 wherein thestationary phase or the precursor of the stationary phase includes atleast one of elemental silicon, silicon dioxide, silicon nitride,elemental aluminum, aluminum oxide, elemental zirconium, zirconiumoxide, elemental titanium, titanium oxide, amorphous carbon, graphiticcarbon, or combinations thereof.
 11. The thin layer chromatography plateof claim 8 where the plurality of stationary phase structures include atleast one of a plurality of hydroxyl groups or a plurality of silanolgroups bonded to the plurality of stationary phase structures.
 12. Thethin layer chromatography plate of claim 8 wherein the plurality ofstationary phase structures form a zigzag pattern, a parallel pattern, adiamond pattern, or a honeycomb pattern.
 13. The thin layerchromatography plate of claim 8 wherein the one or more adhesion priminglayers includes a first adhesion priming layer and a second adhesionpriming layer, wherein the first and second adhesion priming layersinclude different materials.
 14. The thin layer chromatography plate ofclaim 8 wherein the one or more adhesion priming layers are disposed onone or more nanostructures.
 15. A thin layer chromatography plate,comprising: a substrate including a catalyst layer; one or more adhesionpriming layers disposed over the substrate, the one or more adhesionpriming layers defining a plurality of core regions; and a plurality ofstationary phase structures, each of the plurality of stationary phasestructures extends about a corresponding one of the plurality of coreregions, at least some of the plurality of stationary phase structuresexhibiting an elongated geometry, the plurality of stationary phasestructures defining flow channels therebetween, each of the plurality ofstationary phase structures being formed on at least one of the one ormore adhesion priming layers.
 16. The thin layer chromatography plate ofclaim 15 wherein each of the plurality of core regions includes anelongated nanostructure therein that is formed on the catalyst layer.17. The thin layer chromatography plate of claim 16 wherein theelongated nanostructure includes a carbon nanotube or a carbon nanotubethat is at least partially removed.
 18. The thin layer chromatographyplate of claim 15 wherein the plurality of stationary phase structuresinclude at least one of a stationary phase or a precursor of thestationary phase.
 19. The thin layer chromatography plate of claim 18wherein the stationary phase or the precursor of the stationary phaseincludes at least one of elemental silicon, silicon dioxide, siliconnitride, elemental aluminum, aluminum oxide, elemental zirconium,zirconium oxide, elemental titanium, titanium oxide, amorphous carbon,graphitic carbon, or combinations thereof.
 20. The thin layerchromatography plate of claim 15 where the plurality of stationary phasestructures include at least one of a hydroxyl group or a silanol groupbonded to the plurality of stationary phase structures.